Technical parameters/power supply voltage (DC): 1.70V (min)
Technical parameters/number of pins: 63
Technical parameters/access time: 30 µs
Technical parameters/memory capacity: 512000000 B
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.95V
Technical parameters/power supply voltage (Max): 1.95 V
Technical parameters/power supply voltage (Min): 1.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 63
Encapsulation parameters/Encapsulation: BGA-63
External dimensions/packaging: BGA-63
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Each
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34MS04G200BHI003
|
Spansion | 完全替代 | VFBGA |
Tape And Reel / Slc Nand Flash Memory For Embedded, 4GB Densities: 4Bit Ecc, X8 i/o, 1.8V Vcc
|
||
|
|
Cypress Semiconductor | 完全替代 | BGA |
Tape And Reel / Slc Nand Flash Memory For Embedded, 4GB Densities: 4Bit Ecc, X8 i/o, 1.8V Vcc
|
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