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Model S29GL256P11FFIV23
Description Flash, 256MX1, 110ns, PBGA64, 13 X 11MM, 1MM PITCH, LEAD FREE, FBGA-64
Product QR code
Brand: Spansion
Packaging BGA
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
24.64  yuan 24.64yuan
5+:
$ 28.8323
50+:
$ 27.6002
200+:
$ 26.9102
500+:
$ 26.7377
1000+:
$ 26.5652
2500+:
$ 26.3680
5000+:
$ 26.2448
7500+:
$ 26.1216
Quantity
5+
50+
200+
500+
1000+
Price
$28.8323
$27.6002
$26.9102
$26.7377
$26.5652
Price $ 28.8323 $ 27.6002 $ 26.9102 $ 26.7377 $ 26.5652
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(3283) Minimum order quantity(5)
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Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: BGA

External dimensions/packaging: BGA

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs Information/Hong Kong Import and Export License: NLR

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
S29GL256P11FFI010 S29GL256P11FFI010 Cypress Semiconductor 功能相似 BGA-64
GL-P 系列 256 M (32 M x 8) 3.6 V 110 ns 表面贴装 闪存 - FBGA-64
PDF
S29GL256P11FFI020 S29GL256P11FFI020 Cypress Semiconductor 功能相似 BGA-64
GL-P 系列 256 M (32 M x 8) 3.6 V 110 ns 表面贴装 闪存 - FBGA-64
PDF
S29GL256P11FFI020 S29GL256P11FFI020 Spansion 功能相似 BGA-64
GL-P 系列 256 M (32 M x 8) 3.6 V 110 ns 表面贴装 闪存 - FBGA-64
PDF

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