Encapsulation parameters/Encapsulation: TBGA
External dimensions/packaging: TBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGBHI310
|
Cypress Semiconductor | 功能相似 | BGA-24 |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHI310
|
Spansion | 功能相似 | BGA |
SPANSION S25FL512SAGBHI310 闪存, 或非, 512 Mbit, 133 MHz, SPI, BGA, 24 引脚
|
||
S25FL512SAGBHV313
|
Spansion | 功能相似 | TBGA |
Flash Memory Nor
|
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