Technical parameters/frequency: 50 MHz
Technical parameters/halogen-free state: Not Halogen Free
Technical parameters/operating temperature (Max): 95 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: PGBA-256
External dimensions/packaging: PGBA-256
Physical parameters/operating temperature: -40℃ ~ 95℃ (TA)
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC850DECVR50BU
|
NXP | 完全替代 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
|
|
Motorola | 完全替代 | 256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
MPC850DECVR50BU
|
Freescale | 完全替代 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
XPC850DECZT50BU
|
NXP | 功能相似 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 256Pin BGA
|
||
XPC850DECZT50BU
|
Freescale | 功能相似 | BGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 256Pin BGA
|
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