Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 95℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC850DECZQ50BU
|
NXP | 功能相似 | PBGA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
||
MPC850DECZQ50BU
|
Freescale | 功能相似 | PGBA-256 |
MPU PowerQUICC MPC8xx Processor RISC 32Bit 50MHz 3.3V/5V 256Pin BGA Tray
|
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