Technical parameters/Contact electroplating: Tin Lead
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 5.39 mm
Physical parameters/contact material: Brass Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2008
|
Decelect Forgos | 功能相似 |
PCB Terminal, ROHS COMPLIANT
|
|||
2008
|
Dwyer Instruments | 功能相似 |
PCB Terminal, ROHS COMPLIANT
|
|||
|
|
Mill-Max | 完全替代 |
Circuit Board Hardware - PCB 200u SN/PB OVER NI
|
|||
2333-2-00-80-00-00-07-0
|
Mill-Max | 功能相似 |
Standard Solder Terminal Linemin100.00/Pkgtypeb
|
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