Encapsulation parameters/installation method: Through Hole
External dimensions/length: 5.39 mm
Physical parameters/contact material: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Mill-Max | 功能相似 |
Circuit Board Hardware - PCB 200u SN/PB OVER NI
|
|||
|
|
Mill-Max | 功能相似 | Through Hole |
Contact PIN Press Fit ST Bulk
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review