Encapsulation parameters/Encapsulation: FBGA-624
External dimensions/packaging: FBGA-624
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCIMX6DP6AVT8AA
|
NXP | 功能相似 | FBGA-624 |
其他系列 852MHz
|
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