Technical parameters/RAM size: 512 KB
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 624
Encapsulation parameters/Encapsulation: FBGA-624
External dimensions/height: 1.6 mm
External dimensions/packaging: FBGA-624
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 5A992
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 功能相似 | FCPBGA-624 |
i.MX 6DualPlus Processor - Dual-Core, High-Performance, Advanced 3D Graphics, HD Video, Advanced Multimedia, Arm
|
||
MCIMX6DP6AVT8AB
|
NXP | 功能相似 | FBGA-624 |
i.MX 6DualPlus Processor - Dual-Core, High-Performance, Advanced 3D Graphics, HD Video, Advanced Multimedia, Arm
|
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