Technical parameters/power supply voltage (DC): 5.00 V
Technical parameters/number of circuits: 8
Technical parameters/digits: 8
Technical parameters/dissipated power: 500 mW
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/power supply voltage: 2V ~ 6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOIC-20
External dimensions/length: 12.95 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.4 mm
External dimensions/packaging: SOIC-20
Physical parameters/operating temperature: -55℃ ~ 125℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC245D
|
NXP | 功能相似 | SOIC-20 |
Bus XCVR Single 8CH 3-ST 20Pin SOIC
|
||
|
|
Rochester | 功能相似 | TSSOP |
Bus XCVR Single 8CH 3-ST 20Pin SOIC
|
||
74HC245D
|
Philips | 功能相似 | SOIC |
Bus XCVR Single 8CH 3-ST 20Pin SOIC
|
||
74HC245D,652
|
Nexperia | 功能相似 | SOIC-20 |
Nexperia 74HC245D,652 8位 非反相 总线收发器, 20引脚 SOIC封装
|
||
74HC245D,653
|
Nexperia | 功能相似 | SOIC-20 |
74HC245D,653 编带
|
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