Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC245D,653
|
Nexperia | 类似代替 | SOIC-20 |
NXP 74HC245D,653 收发器, 3态, 2 V至6 V, SOIC-20
|
||
|
|
HGSEMI | 完全替代 | DIP-20 |
NXP 74HC245N 芯片, 74HC CMOS逻辑器件
|
||
74HC245N
|
Nexperia | 完全替代 | DIP |
NXP 74HC245N 芯片, 74HC CMOS逻辑器件
|
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