Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 128 KB
Encapsulation parameters/Encapsulation: VFPBGA-256
External dimensions/packaging: VFPBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | VFBGA-256 |
ARM Cortex-M3 166MHz 闪存:128KB RAM:64KB
|
||
|
|
Microsemi | 完全替代 | VFPBGA-256 |
ARM Cortex-M3 166MHz 闪存:128KB RAM:64KB
|
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