Encapsulation parameters/Encapsulation: VFBGA-256
External dimensions/packaging: VFBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | VFBGA-256 |
ARM Cortex-M3 166MHz 闪存:128KB RAM:64KB
|
||
|
|
Microsemi | 完全替代 | VFPBGA-256 |
ARM Cortex-M3 166MHz 闪存:128KB RAM:64KB
|
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