Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Encapsulation parameters/Encapsulation: BGA-896
External dimensions/packaging: BGA-896
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S050T-FG896I
|
Microsemi | 类似代替 | FPBGA-896 |
Ic Fpga Soc 50K Luts
|
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