Technical parameters/RAM size: 64 KB
Technical parameters/FLASH memory capacity: 256 KB
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FPBGA-896
External dimensions/packaging: FPBGA-896
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S050T-FGG896I
|
Microchip | 类似代替 | FPBGA-896 |
其他系列 166MHz 256KB 64KB
|
||
M2S050T-FGG896I
|
Microsemi | 类似代替 | BGA-896 |
其他系列 166MHz 256KB 64KB
|
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