Technical parameters/dissipated power: 1024 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 9.7 mm
External dimensions/width: 4.4 mm
External dimensions/height: 0.9 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Maxim Integrated | 功能相似 | TSSOP |
LVDS或LVTTL / LVCMOS输入14 LVTTL / LVCMOS输出时钟驱动器 LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver
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Maxim Integrated | 功能相似 | TSSOP |
Clock Drivers & Distribution LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver
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