Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tube, Rail |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX9160EUI+
|
Maxim Integrated | 功能相似 | TSSOP |
时钟驱动器及分配 LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver
|
||
|
|
Maxim Integrated | 功能相似 | TSSOP |
Clock Drivers & Distribution LVDS or LVTTL/LVCMOS Input to 14 LVTTL/LVCMOS Output Clock Driver
|
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