Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MicroSMD-4
External dimensions/packaging: MicroSMD-4
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1032UP-25/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-4 |
用于 3 线模拟驻极体麦克风的放大器 4-DSBGA
|
||
LMV1032UP-25/NOPB
|
TI | 完全替代 | XFBGA-4 |
用于 3 线模拟驻极体麦克风的放大器 4-DSBGA
|
||
LMV1032UPX-25/NOPB
|
TI | 完全替代 | XFBGA-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin DSBGA T/R
|
||
LMV1032UPX-25/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin DSBGA T/R
|
||
LMV1032UR-25/NOPB
|
TI | 完全替代 | DSBGA-4 |
传声器前置放大器 Amplifiers for 3-Wire Analog Electret Microphones 4-DSBGA
|
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