Technical parameters/output current: 2.4 mA
Technical parameters/power supply current: 0.085 mA
Technical parameters/number of circuits: 1
Technical parameters/Static current: 60.0 mA
Technical parameters/power supply voltage: 1.7V ~ 5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: XFBGA-4
External dimensions/packaging: XFBGA-4
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1032UP-25/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-4 |
用于 3 线模拟驻极体麦克风的放大器 4-DSBGA
|
||
LMV1032UP-25/NOPB
|
TI | 完全替代 | XFBGA-4 |
用于 3 线模拟驻极体麦克风的放大器 4-DSBGA
|
||
LMV1032UPX-25/NOPB
|
TI | 完全替代 | XFBGA-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin DSBGA T/R
|
||
LMV1032UPX-25/NOPB
|
National Semiconductor | 完全替代 | MicroSMD-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin DSBGA T/R
|
||
LMV1032UR-25/NOPB
|
TI | 完全替代 | DSBGA-4 |
传声器前置放大器 Amplifiers for 3-Wire Analog Electret Microphones 4-DSBGA
|
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