Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M29W800DB70ZE6
|
Micron | 功能相似 | BGA |
NOR闪存 STD FLASH
|
||
M29W800DB70ZE6
|
ST Microelectronics | 功能相似 | TFBGA-48 |
NOR闪存 STD FLASH
|
||
|
|
Numonyx | 功能相似 | TFBGA-48 |
8兆位(1MB X8或X16 512KB ,引导块) 3V供应闪存 8 Mbit (1Mb x8 or 512Kb x16, Boot Block) 3V Supply Flash Memory
|
||
|
|
ST Microelectronics | 功能相似 | TFBGA-48 |
8兆位(1MB X8或X16 512KB ,引导块) 3V供应闪存 8 Mbit (1Mb x8 or 512Kb x16, Boot Block) 3V Supply Flash Memory
|
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