Technical parameters/number of pins: 2
Technical parameters/forward voltage: 390mV @500mA
Technical parameters/thermal resistance: 55℃/W (RθJL)
Technical parameters/forward current: 500 mA
Technical parameters/Maximum forward surge current (Ifsm): 10 A
Technical parameters/forward voltage (Max): 390mV @500mA
Technical parameters/forward current (Max): 500 mA
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/operating temperature: 150℃ (Max)
Technical parameters/dissipated power (Max): 830 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/length: 1.8 mm
External dimensions/width: 1.35 mm
External dimensions/height: 0.8 mm
External dimensions/packaging: SOD-323
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Industrial, power management
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG2005EJ
|
Nexperia | 类似代替 | SOD-323 |
肖特基势垒二极管,200mA 至 500mA,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG2005EJ
|
NXP | 类似代替 | SOD-323 |
肖特基势垒二极管,200mA 至 500mA,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG2005EJ,115
|
NXP | 功能相似 | SOD-323 |
Nexperia 二极管 PMEG2005EJ,115 肖特基, Io=500mA, Vrev=20V, 2引脚 SOD-323F封装
|
||
PMEG2005EJ,115
|
Nexperia | 功能相似 | SOD-323 |
Nexperia 二极管 PMEG2005EJ,115 肖特基, Io=500mA, Vrev=20V, 2引脚 SOD-323F封装
|
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