Technical parameters/number of pins: | 2 |
|
Technical parameters/forward voltage: | 390mV @500mA |
|
Technical parameters/thermal resistance: | 55℃/W (RθJL) |
|
Technical parameters/forward current: | 500 mA |
|
Technical parameters/Maximum forward surge current (Ifsm): | 10 A |
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Technical parameters/forward voltage (Max): | 390 mV |
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Technical parameters/forward current (Max): | 500 mA |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Technical parameters/operating temperature: | 150℃ (Max) |
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Technical parameters/working junction temperature (Max): | 150 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 2 |
|
Encapsulation parameters/Encapsulation: | SOD-323 |
|
Dimensions/Length: | 1.8 mm |
|
Dimensions/Width: | 1.35 mm |
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Dimensions/Height: | 0.8 mm |
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Dimensions/Packaging: | SOD-323 |
|
Physical parameters/operating temperature: | -65℃ ~ 150℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Cut Tape (CT) |
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Other/Manufacturing Applications: | Power Management, Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMEG2005EJ
|
Nexperia | 类似代替 | SOD-323 |
肖特基势垒二极管,200mA 至 500mA,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG2005EJ
|
NXP | 类似代替 | SOD-323 |
肖特基势垒二极管,200mA 至 500mA,Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
|
||
PMEG2005EJ,115
|
NXP | 功能相似 | SOD-323 |
Nexperia 二极管 PMEG2005EJ,115 肖特基, Io=500mA, Vrev=20V, 2引脚 SOD-323F封装
|
||
PMEG2005EJ,115
|
Nexperia | 功能相似 | SOD-323 |
Nexperia 二极管 PMEG2005EJ,115 肖特基, Io=500mA, Vrev=20V, 2引脚 SOD-323F封装
|
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