Encapsulation parameters/installation method: Through Hole
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Ammo Pack
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC107A
|
ST Microelectronics | 功能相似 | TO-206 |
MULTICOMP BC107A 单晶体管 双极, 通用, NPN, 45 V, 150 MHz, 600 mW, 100 mA, 110 hFE
|
||
BC107A
|
Multicomp | 功能相似 | TO-18 |
MULTICOMP BC107A 单晶体管 双极, 通用, NPN, 45 V, 150 MHz, 600 mW, 100 mA, 110 hFE
|
||
BC107B
|
New Jersey Semiconductor | 功能相似 | 3 |
低噪声通用音频放大器 Low noise general purpose audio amplifiers
|
||
|
|
Semelab | 功能相似 | BCY |
低噪声通用音频放大器 Low noise general purpose audio amplifiers
|
||
|
|
Infineon | 功能相似 | TO-18 |
低噪声通用音频放大器 Low noise general purpose audio amplifiers
|
||
BC107B
|
Continental Device | 功能相似 |
低噪声通用音频放大器 Low noise general purpose audio amplifiers
|
|||
BC107B
|
NXP | 功能相似 | BCY |
低噪声通用音频放大器 Low noise general purpose audio amplifiers
|
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