Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1412BV18-250BZXC
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
36 - Mbit的QDR - II SRAM的2字突发架构 36-Mbit QDR-II SRAM 2-Word Burst Architecture
|
||
CY7C1412KV18-250BZXI
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
CY7C1381D 系列 36 Mb (2 M x 18) 250 MHz 2.9 V QDR® II SRAM- FBGA-165
|
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