Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.7V ~ 1.9V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 165 |
|
Encapsulation parameters/Encapsulation: | FBGA-165 |
|
Dimensions/Height: | 0.89 mm |
|
Dimensions/Packaging: | FBGA-165 |
|
Physical parameters/operating temperature: | 0℃ ~ 70℃ (TA) |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1412BV18-250BZC
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
36 - Mbit的QDR - II SRAM的2字突发架构 36-Mbit QDR-II SRAM 2-Word Burst Architecture
|
||
CY7C1412KV18-250BZXI
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
CY7C1381D 系列 36 Mb (2 M x 18) 250 MHz 2.9 V QDR® II SRAM- FBGA-165
|
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