Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
AMD | 功能相似 |
SPANSION S29GL01GS11TFI010 闪存, 1 Gbit, 64M x 16位, 并行, TSOP, 56 引脚
|
|||
S29GL01GS11TFI020
|
Spansion | 功能相似 | TSOP-56 |
NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray
|
||
S29GL01GS11TFIV10
|
Cypress Semiconductor | 功能相似 | TSOP-56 |
SPANSION S29GL01GS11TFIV10 芯片, 闪存, 或非, 1GB, TSOP-56
|
||
S29GL01GS11TFIV20
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
闪存, MirrorBit Eclipse架构, 并行NOR, 1 Gbit, 64M x 16位, CFI, 并行, TSOP, 48 引脚
|
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