Technical parameters/power supply voltage (DC): | 2.70V (min) |
|
Technical parameters/power supply current: | 60 mA |
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Technical parameters/number of pins: | 56 |
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Technical parameters/digits: | 16 |
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Technical parameters/access time: | 110 ns |
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Technical parameters/access time (Max): | 110 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 1.65V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 56 |
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Encapsulation parameters/Encapsulation: | TSOP-56 |
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Dimensions/Packaging: | TSOP-56 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL01GS10TFI010
|
Spansion | 类似代替 | TSOP-56 |
GL-S 系列 1 Gb (64 M x 16) 3.6 V 100 ns 表面贴装 闪存 - TSOP-56
|
||
|
|
AMD | 类似代替 |
GL-S 系列 1G (64M x 16) 3.6 V MirrorBit® Eclipse™ 闪存 非易失性 存储器
|
|||
S29GL01GS11TFI020
|
Spansion | 完全替代 | TSOP-56 |
NOR Flash Parallel 3V/3.3V 1Gbit 64M x 16Bit 110ns 56Pin TSOP Tray
|
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