Technical parameters/digits: 16
Technical parameters/access time (Max): 110 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL512S10DHI010
|
Spansion | 功能相似 | FBGA |
SPANSION S29GL512S10DHI010 闪存, 或非, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL512S10DHI010
|
Cypress Semiconductor | 功能相似 | FBGA-64 |
SPANSION S29GL512S10DHI010 闪存, 或非, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚
|
||
S29GL512S10FHI020
|
Spansion | 功能相似 | LBGA |
NOR Flash Parallel 3V/3.3V 512Mbit 32M x 16Bit 100ns 64Pin FBGA Tray
|
||
S29GL512S11DHI020
|
Cypress Semiconductor | 完全替代 | BGA-64 |
NOR Flash Parallel 3V/3.3V 512Mbit 32M x 16Bit 110ns 64Pin FBGA Tray
|
||
S29GL512S11DHI020
|
Spansion | 完全替代 | FBGA-64 |
NOR Flash Parallel 3V/3.3V 512Mbit 32M x 16Bit 110ns 64Pin FBGA Tray
|
||
S29GL512S11DHIV10
|
Spansion | 完全替代 | FBGA-64 |
闪存, 或非, 并行NOR, 512 Mbit, 32M x 16位, 并行, FBGA, 64 引脚
|
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