Technical parameters/power supply current: 30 mA
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage (Max): 3.6 V
Technical parameters/power supply voltage (Min): 2.7 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 63
Encapsulation parameters/Encapsulation: BGA-63
External dimensions/packaging: BGA-63
Physical parameters/operating temperature: 40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34ML01G200BHI000
|
Spansion | 功能相似 | BGA-63 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - BGA-63
|
||
S34ML01G200TFI000
|
Cypress Semiconductor | 类似代替 | TSOP-48 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - TSOP-48
|
||
S34ML01G200TFI000
|
Spansion | 类似代替 | TSOP-48 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - TSOP-48
|
||
S34ML01G200TFI003
|
Spansion | 类似代替 | TSOP-48 |
SLC NAND Flash Parallel 3V 1G-bit 128M x 8Bit 48Pin TSOP-I T/R
|
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