Technical parameters/power supply voltage (DC): | 2.70V (min) |
|
Technical parameters/power supply current: | 30 mA |
|
Technical parameters/number of pins: | 48 |
|
Technical parameters/digits: | 8 |
|
Technical parameters/access time: | 25 ns |
|
Technical parameters/memory capacity: | 128000000 B |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 3.3 V |
|
Technical parameters/power supply voltage (Max): | 3.6 V |
|
Technical parameters/power supply voltage (Min): | 2.7 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 48 |
|
Encapsulation parameters/Encapsulation: | TSOP-48 |
|
Dimensions/Length: | 18.5 mm |
|
Dimensions/Width: | 12.1 mm |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | TSOP-48 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
|
Other/Manufacturing Applications: | Computers & Computer Peripherals, Computers and computer peripherals |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
Customs information/ECCN code: | 3A991.b.1.a |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34ML01G200BHI000
|
Spansion | 类似代替 | BGA-63 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - BGA-63
|
||
S34ML01G200TFI000
|
Cypress Semiconductor | 完全替代 | TSOP-48 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - TSOP-48
|
||
S34ML01G200TFI000
|
Spansion | 完全替代 | TSOP-48 |
S34ML01G2 系列 1 Gb (128M x 8) 3 V 表面贴装 嵌入式 NAND 闪存 - TSOP-48
|
||
S34ML01G200TFI003
|
Spansion | 完全替代 | TSOP-48 |
SLC NAND Flash Parallel 3V 1G-bit 128M x 8Bit 48Pin TSOP-I T/R
|
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