Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/packaging: TSSOP-8
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI6463BDQ-T1-GE3
|
VISHAY | 类似代替 | TSSOP-8 |
MOSFET 20V 7.4A 1.5W 15mohm @ 4.5V
|
||
ZXM66P02N8TA
|
Zetex | 功能相似 | SOIC-8 |
Trans MOSFET P-CH 20V 8A 8Pin SOIC T/R
|
||
ZXM66P02N8TA
|
Diodes | 功能相似 | SOIC-8 |
Trans MOSFET P-CH 20V 8A 8Pin SOIC T/R
|
||
ZXM66P02N8TC
|
Zetex | 功能相似 |
MOSFET P-CH 20V 6.4A 8SOIC
|
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