Technical parameters/number of channels: 1
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/width: 5.89 mm
External dimensions/packaging: SOIC-8
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SI7682DP-T1-E3
|
Vishay Siliconix | 类似代替 | SO-8 |
MOSFET N-CH 30V 20A PPAK SO-8
|
||
SI7682DP-T1-GE3
|
VISHAY | 类似代替 |
MOSFET N-CH 30V 20A PPAK SO-8
|
|||
SI7682DP-T1-GE3
|
Vishay Siliconix | 类似代替 | SO-8 |
MOSFET N-CH 30V 20A PPAK SO-8
|
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