Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: D2PAK
External dimensions/packaging: D2PAK
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STGB20NB41LZT4
|
ST Microelectronics | 功能相似 | TO-263-3 |
STGB20NB41LZ 系列 N-沟道 442 V 20 A 内部钳位 PowerMESH IGBT-D2PAK
|
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