Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-260
External dimensions/packaging: BGA-260
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
VSC8224XHG
|
Vitesse | 完全替代 | BGA-260 |
PHY 4CH 10Mbps/100Mbps/1Gbps 3.3V 260Pin HSBGA
|
||
VSC8224XHG
|
Microchip | 完全替代 | HBGA |
PHY 4CH 10Mbps/100Mbps/1Gbps 3.3V 260Pin HSBGA
|
||
VSC8224XHG
|
Microsemi | 完全替代 | BGA-260 |
PHY 4CH 10Mbps/100Mbps/1Gbps 3.3V 260Pin HSBGA
|
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