Technical parameters/dissipated power: 3400 mW
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/dissipated power (Max): 3400 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 260
Encapsulation parameters/Encapsulation: BGA-260
External dimensions/packaging: BGA-260
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 5A991.b
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 完全替代 | BGA-260 |
PHY 4CH 10Mbps/100Mbps/1Gbps 3.3V 260Pin HSBGA
|
||
VSC8224HG
|
Vitesse | 完全替代 | BGA-260 |
PHY 4CH 10Mbps/100Mbps/1Gbps 3.3V 260Pin HSBGA
|
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