Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BBGA-196
External dimensions/packaging: BBGA-196
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
VSC3312YYP-01
|
Microsemi | 功能相似 | BGA |
Digital Crosspoint Single 12x12 8.5Gbps 2:1 Mux/1:2 Demux Switch 196Pin FCBGA
|
||
VSC3312YYP-01
|
Microchip | 功能相似 | BGA-196 |
Digital Crosspoint Single 12x12 8.5Gbps 2:1 Mux/1:2 Demux Switch 196Pin FCBGA
|
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