Technical parameters/number of channels: 1
Package parameters/number of pins: 196
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Backboard, cable interconnection
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 4A994.j
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
VSC3312XYP-01
|
Microsemi | 功能相似 | BBGA-196 |
IC CROSSPOINT SW 12X12 196-FCBGA
|
||
VSC3312XYP-01
|
Vitesse | 功能相似 | BBGA-196 |
IC CROSSPOINT SW 12X12 196-FCBGA
|
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