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Model 22-28-4332
Description Conn Unshrouded Header HDR 33POS 2.54mm Solder ST Thru-Hole Bag
Product QR code
Brand: Molex
Packaging
Delivery time
Packaging method Bulk
Standard packaging quantity 1
10.8  yuan 10.8yuan
5+:
$ 12.6325
50+:
$ 12.0926
200+:
$ 11.7903
500+:
$ 11.7147
1000+:
$ 11.6392
2500+:
$ 11.5528
5000+:
$ 11.4988
7500+:
$ 11.4448
Quantity
5+
50+
200+
500+
1000+
Price
$12.6325
$12.0926
$11.7903
$11.7147
$11.6392
Price $ 12.6325 $ 12.0926 $ 11.7903 $ 11.7147 $ 11.6392
Start batch production 5+ 50+ 200+ 500+ 1000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7894) Minimum order quantity(5)
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Technical parameters/number of contacts: 33

Technical parameters/polarity: Male

Technical parameters/Contact electroplating: Tin

Technical parameters/number of rows: 1

Technical parameters/number of pins: 33

Encapsulation parameters/installation method: Through Hole

Packaging parameters/pin spacing: 2.54 mm

External dimensions/length: 83.82 mm

External dimensions/width: 2.49 mm

External dimensions/height: 9.78 mm

External dimensions/pin spacing: 2.54 mm

Physical parameters/shell color: Black

Physical parameters/color: Black

Physical parameters/contact material: Phosphor Bronze

Physical parameters/shell material: Nylon

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Bulk

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
22-28-4330 22-28-4330 Molex 完全替代
2.54毫米（ .100 ）间距KK®头，分离式，立式， 33电路，锡（Sn ）镀层，配合针脚长度6.09毫米（ 0.240 ） 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 33 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240)
PDF
22-28-4331 22-28-4331 Molex 完全替代
Conn Unshrouded Header HDR 33POS 2.54mm Solder ST Thru-Hole KK® Bag
TSW-133-07-T-S TSW-133-07-T-S Samtec 类似代替
SAMTEC TSW-133-07-T-S Board-To-Board Connector, 2.54mm, 33Contacts, Header, TSW Series, Through Hole, 1Rows
PDF

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