Technical parameters/number of contacts: 33
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Tin
Technical parameters/rated current: 4 A
Technical parameters/number of rows: 1
Technical parameters/number of pins: 33
Technical parameters/rated voltage: 250 V
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/length: 83.82 mm
External dimensions/width: 2.49 mm
External dimensions/height: 10.42 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/shell color: Black
Physical parameters/contact material: Brass
Physical parameters/shell material: Nylon
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
22-28-4332
|
Molex | 完全替代 |
Conn Unshrouded Header HDR 33POS 2.54mm Solder ST Thru-Hole Bag
|
|||
TSW-133-07-T-S
|
Samtec | 类似代替 |
SAMTEC TSW-133-07-T-S Board-To-Board Connector, 2.54mm, 33Contacts, Header, TSW Series, Through Hole, 1Rows
|
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