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Model CL-BU-42.5X42.5
Description BGA Chip set TALON ™ Clamp TALON ™ Clamp is a new method for installing and fixing Malico BGA heat sinks. Heat sinks are easy to snap into place and automatically align, without the need for additional holes or secure installation. Uniform installation can adapt to vibration and light impact. There are claw hooks to fix clips of different colors between the board and BGA package, suitable for various BGA packages. Note that the selection of clips must leave space for the thickness of the interface material used. ###BGA heat sink
Product QR code
Brand: Malico
Packaging BGA
Delivery time
Packaging method
Standard packaging quantity 1
6.45  yuan 6.45yuan
10+:
$ 7.7424
100+:
$ 7.3553
500+:
$ 7.0972
1000+:
$ 7.0843
2000+:
$ 7.0327
5000+:
$ 6.9682
7500+:
$ 6.9165
10000+:
$ 6.8907
Quantity
10+
100+
500+
1000+
2000+
Price
$7.7424
$7.3553
$7.0972
$7.0843
$7.0327
Price $ 7.7424 $ 7.3553 $ 7.0972 $ 7.0843 $ 7.0327
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(9312) Minimum order quantity(10)
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Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: BGA

External dimensions/length: 42.5 mm

External dimensions/width: 42.5 mm

External dimensions/packaging: BGA

Physical parameters/color: Blue

Physical parameters/materials: Plastic

Physical parameters/insulation material: Plastic

Compliant with standards/RoHS standards: RoHS Compliant

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