Description:
BGA Chip set TALON ™ Clamp TALON ™ Clamp is a new method for installing and fixing Malico BGA heat sinks. Heat sinks are easy to snap into place and automatically align, without the need for additional holes or secure installation. Uniform installation can adapt to vibration and light impact. There are claw hooks to fix clips of different colors between the board and BGA package, suitable for various BGA packages. Note that the selection of clips must leave space for the thickness of the interface material used. ###BGA heat sink
Description:
BGA High performance precision casting clip for chipset heat sink - additional heat sink for BGA chipset. AL6063 aluminum, with a thermal conductivity of 201 W/m K, available in wing and needle wing types, with a large volume and surface area, and good thermal performance. Plastic clip accessories perform well in natural convection and low pressure below moderate airflow velocity. # # # BGA heat sink
Description:
BGA Chip set TALON ™ Clamp TALON ™ Clamp is a new method for installing and fixing Malico BGA heat sinks. Heat sinks are easy to snap into place and automatically align, without the need for additional holes or secure installation. Uniform installation can adapt to vibration and light impact. There are claw hooks to fix clips of different colors between the board and BGA package, suitable for various BGA packages. Note that the selection of clips must leave space for the thickness of the interface material used. ###BGA heat sink
Description:
BGA Chip set TALON ™ Clamp TALON ™ Clamp is a new method for installing and fixing Malico BGA heat sinks. Heat sinks are easy to snap into place and automatically align, without the need for additional holes or secure installation. Uniform installation can adapt to vibration and light impact. There are claw hooks to fix clips of different colors between the board and BGA package, suitable for various BGA packages. Note that the selection of clips must leave space for the thickness of the interface material used. ###BGA heat sink
Description:
BGA High performance precision casting clip for chipset heat sink - additional heat sink for BGA chipset. AL6063 aluminum, with a thermal conductivity of 201 W/m K, available in wing and needle wing types, with a large volume and surface area, and good thermal performance. Plastic clip accessories perform well in natural convection and low pressure below moderate airflow velocity. # # # BGA heat sink
Description:
BGA High performance precision casting clip for chipset heat sink - additional heat sink for BGA chipset. AL6063 aluminum, with a thermal conductivity of 201 W/m K, available in wing and needle wing types, with a large volume and surface area, and good thermal performance. Plastic clip accessories perform well in natural convection and low pressure below moderate airflow velocity. # # # BGA heat sink
Description:
BGA Chip set TALON ™ Clamp TALON ™ Clamp is a new method for installing and fixing Malico BGA heat sinks. Heat sinks are easy to snap into place and automatically align, without the need for additional holes or secure installation. Uniform installation can adapt to vibration and light impact. There are claw hooks to fix clips of different colors between the board and BGA package, suitable for various BGA packages. Note that the selection of clips must leave space for the thickness of the interface material used. ###BGA heat sink
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