Technical parameters/number of contacts: 16
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1.00 A
Encapsulation parameters/installation method: Through Hole
Packaging parameters/pin spacing: 2.54 mm
External dimensions/pin spacing: 2.54 mm
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standard/REACH SVHC version: 2016/06/20
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2-1571550-4
|
Tyco Electronics | 功能相似 | DIP |
TE CONNECTIVITY 2-1571550-4 芯片插座, DIP, 16路
|
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