Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/number of rows: 2
Technical parameters/number of pins: 16
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/length: 20.32 mm
External dimensions/width: 10.16 mm
External dimensions/packaging: DIP
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 105℃
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
516-AG11D
|
TE Connectivity | 功能相似 | Through Hole |
AMP FROM TE CONNECTIVITY 516-AG11D 芯片插座, DIP, 16路, 通孔安装
|
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