Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Intersil | 功能相似 | DIP |
抗辐射256 ×8 CMOS RAM Radiation Hardened 256 x 8 CMOS RAM
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