Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
5962R9676601QXC
|
Intersil | 功能相似 | DIP |
抗辐射256 ×8 CMOS RAM Radiation Hardened 256 x 8 CMOS RAM
|
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