Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3SD1800A-4CSG484C
|
Xilinx | 完全替代 | FBGA-484 |
XC3SD1800A 4CSG484C 磨码
|
||
XC3SD1800A-4CSG484I
|
Xilinx | 完全替代 | FBGA-484 |
XC3SD1800A 4CSG484I 磨码
|
||
XC3SD1800A-4CSG484LI
|
Xilinx | 完全替代 | FBGA-484 |
XC3SD1800A 4CSG484LI 磨码
|
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