Technical parameters/RAM size: | 193536 B |
|
Technical parameters/number of logic gates: | 1800000 |
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Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 484 |
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Encapsulation parameters/Encapsulation: | FBGA-484 |
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Dimensions/Packaging: | FBGA-484 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3SD1800A-4CSG484C
|
Xilinx | 完全替代 | FBGA-484 |
XC3SD1800A 4CSG484C 磨码
|
||
XC3SD1800A-4CSG484LI
|
Xilinx | 完全替代 | FBGA-484 |
XC3SD1800A 4CSG484LI 磨码
|
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