Encapsulation parameters/Encapsulation: MODULE
External dimensions/packaging: MODULE
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | MODULE |
Mainstream contactless smart card IC for fast and easy solution development
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review