Encapsulation parameters/Encapsulation: | MODULE |
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Dimensions/Packaging: | MODULE |
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Other/Product Lifecycle: | Unknown |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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NXP | 功能相似 | MODULE |
Mainstream contactless smart card IC for fast and easy solution development
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