Technical parameters/switching frequency: 1.00 MHz
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM3501TL-16
|
National Semiconductor | 类似代替 | bump-8 |
Conv DC-DC Single Step Up 2.7V to 7V 8Pin DSBGA T/R
|
||
|
|
National | 类似代替 |
Conv DC-DC Single Step Up 2.7V to 7V 8Pin DSBGA T/R
|
|||
LM3501TLX-16/NOPB
|
National Semiconductor | 完全替代 | microSMD-8 |
Synchronous Step-up DC-DC Converter for White LED Applications 8-DSBGA -40℃ to 85℃
|
||
LM3501TLX-16/NOPB
|
TI | 完全替代 | WFBGA-8 |
Synchronous Step-up DC-DC Converter for White LED Applications 8-DSBGA -40℃ to 85℃
|
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